Heat insulating material


Epoxy resin,Phlogopite

Product Description:


MICA epoxy resin series epoxy-bonded segments mica plate consist of muscovite or phlogopite mica paper, impregnated with a small amount of specially selected epoxy resin. This product is a hard and dense mica plate for use in segment, separators and spacers. It exhibits good electrical properties, mechanical strength, excellent moisture resistance, and can be sawed, sheared and punched into intricate shapes.

★very close tolerances
★excellent elastic and even to open up to 80,000Mpa
★low compressible
★no exudation and displacement at 300℃

Mechanical properties:

Tensile strength resistance Elongation Rate Resistance Coefficient Notched Impact Strength Bending Strength Bending coefficient Bending coefficient Compressive strength Compressibility Friction coefficient
44 -- -- -- 200 -- 362 -- --

Material properties:

Heat deflection temperature
Heat distortion temperature
Short-term maximum temperature Continuous use temperature Thermal conductivity Coefficients of linear expansion Combustion
-- -- 700 1000 0.2 7 V-0

Properties of Electricity:

Volume resistivity Surface Resistance Dielectric Strength Density Rockwell hardness Shao D hardness Water absorption
10E16 -- 24 2.45 -- 88 0.52

Product Type / Size [mm]

Product Type Size  
Film(Sheet Metal)